**What’s Inside iPhone 17 Pro**

The semiconductor stack spans compute, connectivity, power, sensing and materials. **12 companies** supply layers of the phone.

**$TSM** makes A19 Pro. **$AVGO** supplies RF and wireless charging, while Apple’s N1 handles primary Wi‑Fi and Bluetooth. **$QCOM** supplies Snapdragon X80 in Pro models for mmWave, before Apple’s C2 takes over.

**$GLW** supplies cover glass and Ceramic Shield. **$STM** covers Face ID, cameras and power management. **$NXPI** handles NFC, secure payment, USB‑C and connectivity.

**$CRUS**, **$TXN** and **$ADI** supply audio, analog, power and charging chips. **$SONY** makes camera sensors, while **$QRVO** and **$SWKS** provide RF modules and components for cellular signals.

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