🍏 What’s Inside iPhone 17 Pro The semiconductor stack spans compute, connectivity, power, sensing an

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Venture Capital

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The official channel of V3V Ventures. We share updates on our investments, portfolio companies, and fund activities. Buy Ads: @strategy (this is our only account).

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🍏 What’s Inside iPhone 17 Pro

The semiconductor stack spans compute, connectivity, power, sensing and materials. 12 companies supply layers of the phone.

$TSM makes A19 Pro. $AVGO supplies RF and wireless charging, while Apple’s N1 handles primary Wi‑Fi and Bluetooth. $QCOM supplies Snapdragon X80 in Pro models for mmWave, before Apple’s C2 takes over.

$GLW supplies cover glass and Ceramic Shield. $STM covers Face ID, cameras and power management. $NXPI handles NFC, secure payment, USB‑C and connectivity.

$CRUS, $TXN and $ADI supply audio, analog, power and charging chips. $SONY makes camera sensors, while $QRVO and $SWKS provide RF modules and components for cellular signals.

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